Research on Hydrophobic Modification of Silicon Dioxide

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Hydrophobic silicon wafer bonding

Wafers prepared by an HF dip without a subsequent water rinse were bonded at room temperature and annealed at temperatures up to 1100 “C. Based on substantial differences between bonded hydrophilic and hydrophobic Si wafer pairs in the changes of the interface energy with respect to temperature, secondary ion mass spectrometry (SIMS) and transmission electron microscopy (TEM), we suggest that h...

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Silicon/silicon Dioxide Nanostructure in Electrostatic Field

Paper presents a numerical analysis of quantum states and probability ψψ* function of a Si/SiO2 nanostructure in varying electrostatic field. The position of probability function peak xp is traced and the bias, under which it abandons the structure (emission or discharging bias), is determined. Variations of the ground state energy with the bias is also examined. The Poisson Schrödinger model o...

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ژورنال

عنوان ژورنال: Hans Journal of Chemical Engineering and Technology

سال: 2016

ISSN: 2161-8844,2161-8852

DOI: 10.12677/hjcet.2016.65012